Metrology hits the road to integration

Article Abstract:

The semiconductor industry is facing the challenge of adopting integrated metrology due to its transition to 300 mm wafer standards for fab automation. Stand-alone metrology involves tied-ins between different systems to ensure a quick process turnaround. However, in situ metrology has limitations such as process measurement and the growing material complexity and geometrical shrinkage. The postponement of 300 mm is giving industry the time to plan and develop standards on fab automation and communication.

Products & technology - general, Semiconductor Parts NEC, Semiconductor parts

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CD metrology separates shape from scale in pattern transfer

Article Abstract:

A photolithography engineer at Lucent Technologies' Bell Labs, John McIntosh, has created an analysis approach that employs all the information available in a CD-SEM's waveform signal. The intensity analysis of the signal does not only allow the measurement of a feature's specific width, but provides a better estimate of its shape as well. A combination of the CD-SEM with scatterometry makes it possible to get a reliable z versus x and y mapping.

Instrument Manufacturing for Measuring and Testing Electricity and Electrical Signals, Science & research, Waveform Measuring Eqp, Lucent Technologies Inc.

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Copper electroplating enters mainstream processing

Article Abstract:

Copper electroplating is becoming increasingly popular in chip manufacturing as it realized production benefits to early adopters such as IBM and Motorola. Integration methods were also formulated to face issues such as contamination from limiting yield and uneconomical fabrication. The industry is expected to tackle process control problems and will be charged with the task of conducting analyses of the chemistry and composition changes with time.

Manufacturing processes, Semiconductor Devices

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