Drive of a lifetime boosts data storage
Article Abstract:
IBM has developed a new hard disk architecture, known as microdrive, which has a storage capacity 200 times greater than a floppy disk and is slightly larger than a coin. IBM suggests the device, which is available in 340Mb and 170Mb versions, could be used in handheld PCs, digital cameras and GPS systems. The device is being evaluated by Hewlett Packard, Canon and Hitachi for inclusion in future handheld and mobile applications.
Publication Name: Eureka
Subject: Engineering and manufacturing industries
ISSN: 0261-2097
Year: 1998
User Contributions:
Comment about this article or add new information about this topic:
State-of-the-art plumbing for laptops
Article Abstract:
Various thermal problems created by potent integrated chips used in the computer industry can be dealt with the help of heat pipes. The technology used in these heat pipes copies existing thermal management method so redesign is not required.
Publication Name: Eureka
Subject: Engineering and manufacturing industries
ISSN: 0261-2097
Year: 2003
User Contributions:
Comment about this article or add new information about this topic:
Picking up good vibrations
Article Abstract:
A technology that enables skis to adapt to different settings by checking vibrations created by skiing on different snow types has been designed. This technology is also useful in automotive and building industries.
Publication Name: Eureka
Subject: Engineering and manufacturing industries
ISSN: 0261-2097
Year: 2003
User Contributions:
Comment about this article or add new information about this topic:
- Abstracts: Industry on the line? Fatal attraction. Thinking ahead
- Abstracts: Quality time. Putting principles into practice. Principle practice
- Abstracts: Free up your legacy design data. Pick-and-place machine is spot on. Five-axis controller zips food pouches fast
- Abstracts: Captive screws dissipate heat in electronic systems. Drying machine uses novel air jets. Proactive system protects from fire
- Abstracts: Bad bugs detected by sensors. Grand challenges push aero innovation. 3D CAD shows a more solid future