Test and measurement
Article Abstract:
Major trends in test and measurement technologies include the impact that high-performance reduced-instruction-set computer (RISC) processors are having on logic analyzer development, incorporation of multiple processors in new generations of test instruments, increasing need for testability and development of standards based on the laws of physics. The performance of RISC architectures make it difficult to develop in-circuit emulators, so instrument makers such as Tektronix Inc are modifying or developing logic analyzers to give real-time performance suitable for the analysis of RISC systems. The availability of cost-effective but powerful microprocessors and high-capacity memory chips is driving their incorporation into test and measurement equipment, particularly in multi-processor implementations. Increasing chip integration is requiring boundary scan and built-in self-test capabilities to provide sufficient diagnostic performance. New standards for frequency and time are being developed whose accuracy will be increased by orders of magnitude through use of ion trapping and/or laser cooling.
Publication Name: IEEE Spectrum
Subject: Engineering and manufacturing industries
ISSN: 0018-9235
Year: 1992
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Road test: the Impact electric car
Article Abstract:
The field test data on the performance and capabilities of an electric vehicle by General Motors called Impact is discussed. The car has a curb weight of just 1350 kg, a 102-kW three phase ac induction motor and accelerates from zero to 60 mi/h in a very respectable 8.5 seconds. It can go only 110 Km in stop-and-go city driving before its lead acid battery must be recharged. Impact has a regenerator braking system, which uses the motor as a generator to recover and return some of vehicle's kinetic energy to the battery.
Publication Name: IEEE Spectrum
Subject: Engineering and manufacturing industries
ISSN: 0018-9235
Year: 1995
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Test & measurement
Article Abstract:
The electronics test and measurement industry is expected to focus on the development of new testing methodologies for designing and probing boards, wafers and other electronic components. These methods will be based on the design for testability concept which supports integrated circuit testability and reduces production costs. The industry is also expected to approve a new standard for a system-level test bus and apply its expertise to software engineering.
Publication Name: IEEE Spectrum
Subject: Engineering and manufacturing industries
ISSN: 0018-9235
Year: 1996
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