Testing the monster chip
Article Abstract:
Future chips with 100 million transistors will demand new testing approaches in order to keep up with a fast-paced, market-driven industry. Embedded and external tests have been treated as separate issues to date, but will have to complement each other. Repeated testing during volume production screens the ICs, probing wafers even before they are diced. IC testing is used for debugging, diagnosis and repair at the subassembly level as well. Complexity exacerbates many existing problems while creating new ones, including a widening gap between external and internal bandwidth. The volume of test data grows exponentially, and it is no longer possible to depend on external source to test an IC at system speed. System on chip (SOC) design creates new test requirements, especially when core designs are not test-friendly. Future 'monster chips' will embed memories storing up to 256Mb and will require redundant rows and columns of cells. Implications of higher density and reduced cost are discussed.
Publication Name: IEEE Spectrum
Subject: Engineering and manufacturing industries
ISSN: 0018-9235
Year: 1999
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Carbon pillars power microbatteries
Article Abstract:
Marc Madou, a microelectromechanical systems expert at the University of California, Irvine and his collaborators plan to introduce powerful chip-scale batteries that are capable of delivering an intense burst of electricity or a steady flow of relatively low current, and suitable for tiny electronic gadgets. This team has improved current flow even further made room for electrolyte by designing a unique electrode made out of carbon that looks like a bed of blunted nails.
Publication Name: IEEE Spectrum
Subject: Engineering and manufacturing industries
ISSN: 0018-9235
Year: 2004
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As i clearly stated... loser
Article Abstract:
Nantero's idea of using carbon nanotubes to store data has impressed Philip E. Ross enough to call the company a winner for over five years. The company has however failed to produce any concrete results and Philip E. Ross no longer believes that the company could produce the product.
Publication Name: IEEE Spectrum
Subject: Engineering and manufacturing industries
ISSN: 0018-9235
Year: 2008
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