Phone machines answer threat of voice mail

Article Abstract:

The advent of new technology in the answering-machine industry is fueling competition between telephone answering machine manufacturers and large telecommunications companies for the answering device market. New integrated circuits from National Semiconductor Inc and DSP Group Inc utilize digital-signal processing that translates the human voice into digital code. Incorporating this technology into telephone answering machines could reduce the size of such machines and enable message saving and mailboxes features currently offered in the voice mail systems of US West Inc and other regional phone companies. The all-digital answering machines hold approximately seven minutes of messages, do not support mailboxes and cannot reproduce the human voice as well tape yet. Chips and products that address these shortcomings are in development from DSP Group and Matsushita Electric Industrial Co.

Telephone and telegraph apparatus, Product development, Product information, Marketing, Telecommunications equipment industry, Voice I/O equipment, Voice mail, Telephone answering and recording equipment, Answering machines, Market Analysis, Telephone Answering Devices

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LSI Logic plans to tailor chips in new strategy

Article Abstract:

LSI Logic Corp plans to market computer chips that can be customized according to customer specifications. The new chips are based on LSI's CoreWare technology which permits the manufacturer to customize a chip by printing a microprocessor onto one part of the chip and then printing circuits onto other parts of the chip. The LSI chips will permit customers to combine a processor with any electronic blocks found in LSI's specialized circuit library or any customer-designed circuits. The initial releases will be based on MIPS Computer Systems Inc and Sun Microsystems Inc architectures. LSI expects the sales for the new chips to make up 10 percent of its revenues for 1993 and 20 percent in 1994. Competitors Intel Corp and Motorola Inc offer similar chips, but these are less flexible because they do not allow customers to etch additional circuits.

Semiconductor devices, Innovations, Microprocessor, CPUs (Central processing units), Electronic components, LSI Logic Corp., LSI, Product introduction, Application specific integrated circuits, Outlook, Semiconductor Device, Marketing Strategy, Semiconductor Industry, New Technique, Custom IC

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