Making the right moves

Article Abstract:

The semiconductor and semiconductor production equipment industries are moving toward an industry-standard 300mm wafer size, which promises significant technological gains. However, costs will be high: industry associations estimate the cost of the transition at $15 to $20 billion. Semiconductor companies, remembering the huge costs of the early 1980s transition to 200mm wafers, are reluctant to be pioneers, especially since the process equipment is not yet fully tested and refined. However, the costs of research have fallen disproportionately on the $16.7 billion semiconductor equipment industry, which is only a fraction the size of the $150 billion semiconductor industry. International industry associations are working to develop standards for equipment and assess its performance before systems are built and purchased. Analysts expect 300mm wafer production to begin sometime in 1998, and to represent 15% of semiconductor production by 2001.

Semiconductor devices, Planning, Semiconductor chips, Semiconductor device, Electronic components, Industry trend

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Projections limited

Article Abstract:

The demand for advanced photomasks may begin to outpace production. Some observers believe that lagging capacity in the photomask industry could delay the launches of next-generation integrated circuits (ICs). This shortfall may be attributed to US IC manufacturers' heavy dependence on outsourcing for photomasks. In the US, merchant suppliers presently provide nearly 70% of photomasks. Some companies, such as IBM Corp. and Intel Corp. maintain internal photomask production facilities. Officials at both companies stated that these internal operations not only act as safeguards against supply shortages, but also protect intellectual property. IC companies without internal photomask facilities have sought to gird themselves against supply disruptions by forming guaranteed supply agreements with their merchant suppliers. By the year 2000, the $1.8-billion worldwide merchant photomask market will grow to $4 billion.

Semiconductor and Related Device Manufacturing, Integrated Circuits, Management, Market trend/market analysis

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Chipping away at package size

Article Abstract:

Tessera Inc produces chip scale packages (CSP) using micro ball grid technology, which makes it possible to make CSPs as small as a die. The technology trims weight and space requirements and handles thermal expansion coefficients well using a proprietary, stress-absorbing mounting tape. The CSP market is small but could grow rapidly as CSPs can be packaged at semiconductor fabrication sites, reducing time and trouble for original equipment manufacturers. CSPs have cost advantages and are currently priced just above the cost of thin small outline plastic packages (TSOP). Tessera Pres John Smith expects CSP prices to be less than any other type of packaging on a per pin basis by early 1998. Tessera has further developed CSPs to be processed with ICs before wafer dicing but is awaiting further development of process equipment in two-to-three years before the technology can be fully implemented.

Research, Integrated circuit design, Circuit design, Company technology development, Packaging density (Electronics), Tessera Inc.

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