First three-chip stacked CSP developed

Article Abstract:

Sharp Electronics Corp, a Hamburg, Germany-based semiconductor manufacturer, claims that it has introduced the first three-chip stacked chip-sized package in the world market. The invention of these silicon chips was primarily targeted to the cellular telephone market and the information and communications handheld terminal market. The device utilizes a Sharp-developed technology that uses special thin silicon wafers with die and wire bonding.

Product introduction, Semiconductors NEC, Sharp Electronics Corp.

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New fab is easy on environment

Article Abstract:

STMicroelectronics has launched a new 200 mm wafer fab that employs state- of-the-art manufacturing techniques including mini-environment/isolation technology. The system was developed in response to the increasingly stringent air-quality requirementns of each future new technology generation without escalating financial and environmental costs for air purification. The design of the plant was in accord with STMicroelectronics' commitment to attain environmental neutrality.

Product information, France, Silicon Wafers, Semiconductor wafers, STMicroelectronics

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Novel radiation source developed for EUV

Article Abstract:

Researchers at the Lehrstuhl fur Lasertechnik and the Fraunhofer Institut fur Lasertechnik, both based in Aachen, Germany, developed an economical and compact gas discharge source emitting in the extreme ultraviolet (EUV) range. The new radiation source is being considered to be an option to laser-produced plasma EUV sources for lithography. EUV wavelengths in the 13 nm region were produce with the help of the 2p-4e transitions in oxygen.

Product development, Other Measuring and Controlling Device Manufacturing, Instrument Radiation Sources, Radiation (Physics), Instruments (Equipment)

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