OEMs can't get the big picture
Article Abstract:
Notebook computer OEMs are experiencing shortages in the supply of 12.1-inch thin-film-transistor active matrix (TFT-AM) LCD displays as the demand has been greater than anticipated. Some LCD producers are in the midst of shifting to second-generation manufacturing plants for 12.1-in display production. The combination of supply problems and price differential has caused some notebook OEMs to use more super-twisted-nematic passive matrix LCDs with a 12.1-in passive matrix SVGA display costing less than $300 compared to a 12.1-in active matrix SVGA display costing $650-$700. Notebook makers Compaq and HP state they are little affected by the current shortage. The supply situation is expected to improve in the second half of 1997 as more capacity is added and notebook sales are expected to drop somewhat, according to Sweta Dash of market research firm Stanford Resources.
Publication Name: Electronic Business Today
Subject: Electronics and electrical industries
ISSN: 1085-8288
Year: 1997
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Repaving the information superhighway
Article Abstract:
The Regional Operating Bell Companies (RBOCs) are battling the Internet service providers over rate structures for telecommunications network traffic. RBOCs had hoped to charge ISPs with access fees, but the FCC seems opposed to that tactic. While local service providers claim that network traffic unfairly congests phone lines, ISPs claim that many technologies exist to increase network capacity, and that RBOCs should invest in new infrastructure instead of simply raising rates. Digital subscriber line technology could utilize existing infrastructure to deliver voice and data connectivity at speeds of 5 to 6 Mbps. The Internet Access Coalition, which includes industry heavyweights such as Intel, AOL, Compaq, DEC, EDS, IBM, Microsoft, and Novell, are opposed to the RBOC's proposals, and back the adoption of new bandwidth-enhancing technologies.
Publication Name: Electronic Business Today
Subject: Electronics and electrical industries
ISSN: 1085-8288
Year: 1997
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Look before you leap
Article Abstract:
Contract manufacturers continue to invest heavily in conventional surface mount technology (SMT) equipment rather than in such new technologies as chip on board (COB) and ball grid arrays (BGA). BGAs do not need a large equipment investment. COB, on the other hand, is not yet mature enough to merit widespread implementation. While manufacturers are slow to adopt the new technologies, 25% of them are focusing on BGA as their next-generation packaging technology, according to a survey of PCB manufacturers by Technology Forecasters. Other respondents cited fine pitch placement and COB as their technologies of choice. Modest investments are taking place in specialized equipment for advanced techniques. SCI Systems, for example, is putting money on COB in anticipation of a growing demand for it.
Publication Name: Electronic Business Today
Subject: Electronics and electrical industries
ISSN: 1085-8288
Year: 1997
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