Sputtering targets adapt to new materials and shrinking architectures
Article Abstract:
The semiconductor industry is utilizing the process of sputtering to create new materials to meet the increasing demands for performance on semiconductor devices. More exotic materials such as ruthenium, will probably be mainstream in five years time replacing the classic aluminum, titanium and copper because semiconductors are starting to hit limits in terms of capacitors as well as silicide materials. Industry insiders cited that although larger wafers, the advent of new materials and smaller wafers are challenging the capabilities of sputtering, the process can still be used to meet the demands of next generation devices.
Comment:
The semiconductor industry is using the process of sputtering to create new materials in manufacturing semiconductor devices
Publication Name: Semiconductor International
Subject: Electronics and electrical industries
ISSN: 0163-3767
Year: 1998
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Cleanroom technologies continue to keep contamination at bay
Article Abstract:
Semiconductor makers keep contamination at acceptable levels by using a variety of cleanroom technologies. These technologies as existing filtration systems, continue to be efficient especially in the large wafer and smaller CD products category. The industry, however, is moving towards shrinking measurements and higher efficiencies, which in effect raises the fragility and sensitivity of products. Concerns on other potential contaminants such as gases and static discharge with electromagnetic interference remain unattended as well as use of copper metalization that makes it more difficult to detect small-particle deficiencies.
Publication Name: Semiconductor International
Subject: Electronics and electrical industries
ISSN: 0163-3767
Year: 1998
User Contributions:
Comment about this article or add new information about this topic:
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