TI-Acer jv to become Acer subsidiary
Article Abstract:
The Acer Group of Taipei, Taiwan, will acquire the 33% stake of Texas Instruments (TI) of Dallas, TX, in the TI-Acer memory chip manufacturing joint venture in Hsinchu, Taiwan. Under the agreement, Acer will continue to operate the manufacturing facility, with its workforce of 1,500, under the new name Acer Semiconductor Manufacturing Inc. (ASMI). The deal also includes terms for a 10-year patent cross-license agreement and would allow ASMI to manufacture its own products as well as serve as a foundry for products of other companies. Presently, Acer holds 48% of the joint venture's voting shares while other investors hold 19%. The transaction, which is subject to third party approvals, is expected to close within the second quarter of 1998.
Comment:
To acquire the 33% stake of Texas Instruments of Dallas, TX, in the TI-Acer memory chip manufacturing joint venture in Taiwan
Publication Name: Semiconductor International
Subject: Electronics and electrical industries
ISSN: 0163-3767
Year: 1998
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Micron buying TI's memory business
Article Abstract:
Micron Technology has agreed to buy the assets of Texas Instruments' (TI's) semiconductor memory business in a transaction worth around $800 million. The deal includes the acquisition of virtually all of TI's memory assets, including TI's shares in its two DRAM manufacturing joint ventures. The deal was seen by both firms as advantageous, with Micron enlarging its memory market participation and TI strengthening its emphasis on digital signal processing and analog products. The agreement is anticipated to be finalized in the second half of 1998. Aside from TI's memory assets, Micron will get $750 million in financing from TI to allow the deployment of Micron's technology throughout the business.
Comment:
Agrees to buy the assets of Texas Instruments' semiconductor memory business in a transaction worth around $800 million
Publication Name: Semiconductor International
Subject: Electronics and electrical industries
ISSN: 0163-3767
Year: 1998
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Will there be an I/O catastrophe in 2010
Article Abstract:
A researcher at the International Business Machines Corp has addressed the problem that circuit densities could increase past the capability of routing I/O connections away from the semiconductor chip. It was shown that catastrophe would take place not in routing I/Os off the die but where the package meets the board. It was suggested that the problem could be be solved by designing systems that minimizes inter-chip I/O densities and uses intra-chip high-bandwidth communications.
Publication Name: Semiconductor International
Subject: Electronics and electrical industries
ISSN: 0163-3767
Year: 1999
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