Zilog Wafer Module III: a new age wafermanufacturing facility
Article Abstract:
Zilog's wafer fab Module III in Nampa, ID, reflects the company's low-cost, small footprint fab concept. Module III, which has cost Zilog $175 million so far, is projected cost a total of $250 million at maximum capacity. The fab is projected to have a full revenue capacity of around $400 million. In designing the small fab, Zilog engineers had to take into account factors such as interbay wafer movement and wafer size. Other factors such as the size of the site and minienvironments were also considered.
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Wafer fab Module III in Nampa, ID, reflects the company's low-cost, small footprint fab concept
Publication Name: Semiconductor International
Subject: Electronics and electrical industries
ISSN: 0163-3767
Year: 1998
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A fab is not built by layout alone: the case for a concurrent utility matrix
Article Abstract:
An accurate estimate of a fab's utility requirements results in improved system design which, in turn, leads to cost savings since systems will fit actual demandd. It also creates and increased flexibility for changes in the toolset and fab during construction and renovation stages. Also, with each design iteration, the utilities data are polished and the system design becomes more accurate which enables designers and owners to minimize utilities system design cost and maximize its flexibility.
Publication Name: Semiconductor International
Subject: Electronics and electrical industries
ISSN: 0163-3767
Year: 2000
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Copper, low-k metrology scale the learning curve
Article Abstract:
The semiconductor industry is entering into a period where new materials and processes that will require special measurement capabilities are needed. Dielectrics and copper in its numerous forms present processing, integration and metrology challenges that must be solved almost instantly so that new technologies can be applied in production. The most significant obstacle being faced by copper/low-k metrology is that there are many small challenges that combine to create major problems.
Publication Name: Semiconductor International
Subject: Electronics and electrical industries
ISSN: 0163-3767
Year: 2000
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