Air bag fatalities spur smarter designs
Article Abstract:
Air bag manufacturers are redesigning the air-bag to include 'smart' technology which will prevent them from causing fatal injury. The innovative automobile safety device will inflate according to impact variables such as crash force, crash angle and weight of passengers. It will coordinate side air bags and lap-shoulder belt tension at crash impact and operate according to strict National Highway Transportation Safety Administration standards.
Publication Name: IEEE Spectrum
Subject: Engineering and manufacturing industries
ISSN: 0018-9235
Year: 1997
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Showdown at Yucca Mountain
Article Abstract:
The US Energy Dept's plan to dump 70,000 Mg of plutonium and other radioactive material under Nevada's Yucca Mountain is under review following the Bowman-Venneri report indicating possible nuclear explosion. Steel corrosion over a long time may damage the containers releasing fissile material in the water and rock leading to criticality. Other studies contradict this demanding detailed analysis using actual data to asses the risks.
Publication Name: IEEE Spectrum
Subject: Engineering and manufacturing industries
ISSN: 0018-9235
Year: 1995
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Chip making wet new world
Article Abstract:
A thin layer of water between the lens and the wafer will extend the life of chip making's dominant technology, and may be worth hundreds of billions of dollars to an industry battling the limits of physics. In a matter of 12 months the future of lithography, the technology of making chips, has been upgraded by the use of extreme ultraviolet lithography, due to Intel Corp., Santa Clara, Calif.
Publication Name: IEEE Spectrum
Subject: Engineering and manufacturing industries
ISSN: 0018-9235
Year: 2004
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- Abstracts: Calibrating simulation tools for nanometer designs. The attractions of technology. The environment
- Abstracts: Switching megawatts takes microseconds. Parts from bins in a spin
- Abstracts: Reconciling conflicting design-automation standards. Software R&D: from an art to a science. Transportation
- Abstracts: Still waiting for the bus. Cool for Cat 6. Echelon holds the chips
- Abstracts: Process evaluation capability analysis of complex parts. SPC modified with percent tolerance precontrol charts