Chips go vertical
Article Abstract:
The concept of the third dimension (3-D) is explored in order to find new ways that would enable designers to make ultrafast chips. It is observed that by stacking chips and directly connecting them with vertical wires, chipmakers help interconnects keep up with increasing transistor speeds.
Publication Name: IEEE Spectrum
Subject: Engineering and manufacturing industries
ISSN: 0018-9235
Year: 2004
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Flash of brilliance or flash in the pan? Giant planar Hall effect could be the next big thing in data storage
Article Abstract:
Researchers at the California Institute of Technology and the University of California (Santa Barbara) have discovered a new effect, called the giant planar Hall effect, which could, it is thought, greatly increase the sensitivity of read heads and the capacity of hard disks.
Publication Name: IEEE Spectrum
Subject: Engineering and manufacturing industries
ISSN: 0018-9235
Year: 2003
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The quest for the spin transistor
Article Abstract:
Microelectronics researchers investigating spin envision a new form of electronics, called spintronics. Many advantages are foreseen, including many that derive from possibilities suggested by the quantum theory that describes spintronics.
Publication Name: IEEE Spectrum
Subject: Engineering and manufacturing industries
ISSN: 0018-9235
Year: 2001
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