DSPs court the consumer
Article Abstract:
Digital signal processors (DSPs) that can perform complex audio compression functions are making it possible to bring many innovative consumer products to the market, one of the best known being home audio and home theater systems. AC-3 developed by Dolby Laboratories is a transform compression scheme and is used in HDTV, and movie and home theater systems for up to six channels. Cost-effective DSPs are used with it. Many answering machines no long use an analog tape and thus have better reliability and other features. In adaptive suspension systems of some high-end automobiles DSPs can be found. Video games could not exist, were is not for digital signal processing (DSP). Data compression, especially for music and speech signals, is a major place for use of DSP technology. Transform-domain weighted interleave vector quantization (TwinVQ) developed by NTT Corp. (Tokyo) will be prominent in various consumer products to be released, including SolidAudio, a hand-held portable device to download encoded audio from the Internet and to play it. It will come from NTT and Kobe Steel in late 1999; it has no moving parts and no skipping. Companies discussed include Zoran Corp. Texas Instruments, ZSP Corp. and Berkeley Design Technology Inc.
Publication Name: IEEE Spectrum
Subject: Engineering and manufacturing industries
ISSN: 0018-9235
Year: 1999
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The digital signal processor derby
Article Abstract:
Applications that rely on digital-signal processors (DSP) are proliferating, and the market, which has expanded rapidly, was estimated to be worth $6 billion in the year 2000. Meanwhile, DSP-enabled general-purpose processors are emerging as potential marketplace competitors. DSP processors still retain advantages in terms of price and power consumption, but these advantages are seen as surmountable. Moreover, general-purpose processors usually have better software development tools than DSPs.
Publication Name: IEEE Spectrum
Subject: Engineering and manufacturing industries
ISSN: 0018-9235
Year: 2001
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Packages go vertical
Article Abstract:
A new approach opens the possibility to put system-in-a-package (SIP) chips into serious contention with system-on-a-chip (SoC) designs. Called system-in-a-stack, the technique exploits the third dimension. Going upward instead of outward shortens interconnect distances, which reduces delays and capacitance. Power requirements also can be cut, and noise minimized.
Publication Name: IEEE Spectrum
Subject: Engineering and manufacturing industries
ISSN: 0018-9235
Year: 2001
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