Intel's new computer chip can do 2 jobs at one time

Article Abstract:

Intel Corp will introduces a breakthrough in computer technology with the company's new microprocessor, i960 CA, which can handle two tasks at once. The microprocessor will most likely be used first in laser printers. The product targets the embedded controllers market - computer chips that perform highly specialized functions. The i960 chip simultaneously fetches, decodes and begins executing more than one instruction for each tick of its internal clock, which is known as superscalar technology. Intel reports that the technology is the next step towards parallelism, the ability of a computer to process multiple tasks simultaneously, which could be used in high-speed color processing. The i960 will not be used in microcomputers and is not compatible with software used in such machines. About 65 percent of its market will be in imaging equipment, such as laser printers or facsimile machines.

Microprocessor, CPUs (Central processing units), Laser printers, Imaging systems, Parallel processing, Multitasking (Computing), Product Introduction, product announcement, Laser Printer, Multitasking, Facsimile, Controllers, Imaging Technology, Intel 80960CA (Microprocessor)

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Intel forms chip venture with company from Japan

Article Abstract:

Intel Corp has established a joint venture with NMB Semiconductor of Japan to manufacture and market dynamic random access memory chips (DRAMs). The joint venture follows closely upon the announcement of the demise of U.S. Memories, a US consortia of semiconductor and computer companies that would have manufactured D-RAMs. Both ventures set out to provide more independent sources of D-RAMs, helping to eliminate US reliance on Japan chip manufacturers. Unlike other Japanese semiconductor companies, NMB does not make computers. Therefore, US companies would not need to worry about buying products from competitors.

Planning, Joint ventures, Manufacturing, Product development, International competition (Economics), DRAM (Dynamic random access memory), Magnetic media, Magnetic storage media, DRAM, Joint Venture, Integrated Circuits, Japanese Competition, NMB Semiconductor Company Ltd., Intel/NMBS DRAMS Fabrications Co.

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Digital Equipment demonstrates chip packaging

Article Abstract:

DEC announces a new technique of chip packaging that will allow the equivalent of four very large boards to be put on a air-cooled five-inch square. This technology will dramatically reduce the time a signal takes to travel between chips. DEC plans to add the chips to its new VAX mainframe and claims that performance increases will be significantly more than twofold. If the claims are true, the new DEC mainframes will be more competitive with IBM and other mainframes.

Innovations, Semiconductor chips, Digital Equipment Corp., DEC, New Technique, Chip Packaging

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