Creep behavior and deformation mechanisms map of Sn-Pb eutectic solder alloy
Article Abstract:
The study presents a large number of creep tests that were carried out using miniature specimens in order to gain a fundamental understanding of the creep behavior. A deformation mechanisms map was established for the widely used Sn-Pb eutectic solder alloy in order to interpret the creep mechanisms under different temperatures and loading conditions.
Publication Name: Journal of Engineering Materials and Technology
Subject: Science and technology
ISSN: 0094-4289
Year: 2003
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Computer identification of structural weaknesses in locally anisotropic polycrystalline materials
Article Abstract:
The behavior of mesoscopic stress responses in a simulated polycrystalline material sample containing a large amount of constituent grains for a number of polycrystalline materials is investigated by performing computer experiments. The homogenization of materials with locally anisotropic microstructure is discussed.
Publication Name: Journal of Engineering Materials and Technology
Subject: Science and technology
ISSN: 0094-4289
Year: 2001
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Constitutive relations for inelastic deformation and damage accumulation in hard alpha titanium
Article Abstract:
A set of constitutive data is used to develop constitutive equations for describing the inelastic deformation and damage accumulation behavior of hard alpha Ti. A treatment of the damage accumulation process is required to give an accurate description of the inelastic flow of hard alpha with high nitrogen content.
Publication Name: Journal of Engineering Materials and Technology
Subject: Science and technology
ISSN: 0094-4289
Year: 2001
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