On hydrogen-induced void nucleation and grain boundary, decohesion in nickel-base alloys
Article Abstract:
A micro mechanical model is used to understand the interaction of void nucleation and growth with the failure of the grain boundaries. The analysis is carried out in a unit cell comprising an elastic particle embedded in a ductile matrix, a grain boundary along a plane of symmetry of the cell, and loaded in plain strain perpendicularly to the grain boundary.
Publication Name: Journal of Engineering Materials and Technology
Subject: Science and technology
ISSN: 0094-4289
Year: 2004
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Equivalent time measurement model for physical aging and temperature effects on polymer creep and relaxation
Article Abstract:
The constraint imposed on the time-temperature superposition method by physical aging, namely that applies only to unaged data is reviewed and validated with experimental data. A standardized method for shifting momentary creep curves from several specimens in order to obtain a time temperature superposition (TTSP) master curve is presented.
Publication Name: Journal of Engineering Materials and Technology
Subject: Science and technology
ISSN: 0094-4289
Year: 2004
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Formation of microscopic voids in resin transfer molded composites
Article Abstract:
A study is conducted to investigate void distribution of a disk-shaped, E-glass/spoxy composite part manufactured by resin transfer molding. Voids are found to concentrate primarily within or adjacent to the fiber performs. Void content is found to fluctuate through the thickness of the composite.
Publication Name: Journal of Engineering Materials and Technology
Subject: Science and technology
ISSN: 0094-4289
Year: 2004
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