Compliant leads double as probes

Article Abstract:

A lead/probe technology based on wirebonding called microsprings has been developed by Livermore, CA-based FormFactor. The process involves the bonding of gold wire to the chip, given an S or other shape, then burning off using wirebond technology. The resulting curled-up probe fingers demonstrate good resilience. Aside from its use as probes, the contacts can be used in flip-chip-type applications and interconnect ppitches down to 6 microns were demonstrated.

Science & research

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The Top Fab 1999 of White Oak

Article Abstract:

White Oak Semiconductor's Sandston, VA, facility has been recognized by 'Semiconductor International' magazine as 1999's top fabrication plant. The 800,000-sq-ft plant features 250 nm technology and manufactures 64 Mb SDRAMs. White Oak continues to ramp up on technology shrinks every six months in an active effort to reduce product cycle times and maximize its manufacturing processes.

Facilities & equipment, Semiconductor devices, White Oak Semiconductor

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