Roadmap emphasizes co-design challenge
Article Abstract:
The 1999 International Technology Roadmap for Semiconductors has identified near-term and long-term challenges for semiconductor packaging. The report notes the emerging trend for packaging design that not just centers on the performance function, but also considers performance, reliability, thermal, power management and costs factors. The Roadmap also emphasizes the need for semicondutor manufacturers to develop a technology that will allow the co-design of chip, package and board.
Publication Name: Semiconductor International
Subject: Electronics and electrical industries
ISSN: 0163-3767
Year: 2000
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Economic outlook: kicking into high gear
Article Abstract:
The semiconductor industry is observed to follow predictable economic cycles. Hence, the strong performance of the industry in 1999, which reached high-single digit to low-double digit growth rates, is predicted to continue for the next two to three years with growth projections in the 20% to 30% range. It is also believed that increasing stringent end market requirements will drive technological developments in the semiconductor industry.
Publication Name: Semiconductor International
Subject: Electronics and electrical industries
ISSN: 0163-3767
Year: 2000
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Packaging provides viable alternatives to SOC
Article Abstract:
The development of system-on-a-chip (SOC) designs and deices has faced more challenges as the demand for more functionality in electronic systems continues to grow. While there are good reasons to use an SOC design, there are also good reasons for looking at alternatives due to the cost of integration. In addition, performance concerns may make a multichip system preferable. One advantage of the use of SOC is that on-chip integration enables faster interconnection between circuit components.
Publication Name: Semiconductor International
Subject: Electronics and electrical industries
ISSN: 0163-3767
Year: 2000
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