MCM has chips in redistribution

Article Abstract:

German researchers have developed a multichip module (MCM) by extending the redistribution concept. Using thin film processes, the new approach creates the MCM substrate from copper traces in a benzocyclobutene dielectric set on a depleted silicon wafer. Individual dice are then flip- chip attached onto the substrate. Results indicate that the approach can allow the production of packages with 6,000 I/Os per square centimeter.

Product development, Germany

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More chip-scale packages?

Article Abstract:

The number of chip-scale packages (CSP) has increased significantly in the past few years. The current number has increased to about 100 from 60 two years ago. Two prominent CSP makers are Multichip Assembly of San Jose, CA, and Chip Supply of Orlando, FL. Multichip Assembly's McCSP uses 0.3 mm balls for the I/0s. Chip Supply's DieScale is a BGA with a two- to four- layer BT resin substrate and nickel/gold-plated copper conductors.

Product information, Multichip Assembly

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Flip-chip packaging: prepare for ramp-up

Article Abstract:

The semiconductor industry is preparing to upgrade the flip-chip packaging technology as measurements of its semiconductors shrinks and performance requirements increases. The industry expects flip-chip to become more dominant in the industry while wirebonding technology will remain the dominant technology used for commodity semiconductor products until flip-chip becomes more affordable. Among the developments in flip-chip packaging are more bumping methods and the polymer flip-chip packaging that does not need the use of solder. Flip-chip packaging, however, is still immature based on its infrastructure for manufacturing, testing and handling of flip-chips.

Comment:

Semiconductor ind prepares to upgrade flip-chip packaging tech as products shrinks and performance requirements increases

Semiconductor Devices, Manufacturing processes, Article

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