Researchers develop non-contact technique for cleaning wafers
Article Abstract:
Phrasor Scientific Inc of Duarte, CA, has developed a non-contact wafer cleaning method called NanoClean. The technique is essentially a dry in- situ method that cleans flat and contoured surfaces of submicron debris in one step without using rinse or dry cycle. The method involves the generation of an energetic beam of charged micro-clusters that impact submicron particles.
Publication Name: Semiconductor International
Subject: Electronics and electrical industries
ISSN: 0163-3767
Year: 1999
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Material corrosion study belies conventional wisdom
Article Abstract:
Swagelok Co of Solon, OH, has concluded in its study that manganese has little or no effect on the corrosion resistance of EP 316L stainless steel tubing. The results also showed that the base chemistry of the tubing detemines the corrosion resistance. Chromium and nickel for as-welded tubing improved pitting corrosion resistance, while sulfur had detrimental effect. It was also shown that molybdenum and copper enhance general corrosion resistance while manganese had a slight detrimental role.
Publication Name: Semiconductor International
Subject: Electronics and electrical industries
ISSN: 0163-3767
Year: 1999
User Contributions:
Comment about this article or add new information about this topic:
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