300 mm wafers: implications to fab architecture
Article Abstract:
A number of semiconductor companies are engaged in the development of minienvironment fabs for 300 mm wafers. The goal is to reduce manufacturing cost, and by using 300 mm wafers, manufacturers are able to cut costs because they can fabricate more chips per wafer. The rethinking of fab models is also part of the goal and industrywide cooperative efforts over the past four years through I300I, the Semiconductor Leading-Edge Technologies (SELETE) and SEMI have sought to standardize some elements of a 300 mm fab. SEMI and industry volunteers has developed standards for 300 mm wafer tool port interfaces (loadports) and carriers (pods).
Publication Name: Semiconductor International
Subject: Electronics and electrical industries
ISSN: 0163-3767
Year: 1998
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An update: transition to 300 CMP
Article Abstract:
Chemical mechanical polishing (CMP) equipment and process in the semiconductor industry continues to shift from 200 to 300 nm, albeit at a slower rate than expected. Amid the development, various semiconductor companies are evaluating their development plans to fulfill projected future demand. This is being achieved through efforts such as upgrading current 200-mm tool designs, as well as investigating new technologies and designs, as alternatives for conventional platen and rotary polishers.
Publication Name: Semiconductor International
Subject: Electronics and electrical industries
ISSN: 0163-3767
Year: 1998
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