Momentum builds behind embedded PCs; embracing the PC architecture for embedded systems

Article Abstract:

The X86 processor architecture, in a range of applications from single-chip solutions to PC-compatible boards and modules, is impacting the embedded systems market. The communications equipment industry, in particular, is attempting to harness a variety of PC technologies and systems to span a range of embedded systems needs. Some 20% of embedded systems designs now feature a type of PC ISA-bus architecture. Potential applications range from telephone answering devices to fax devices and set-top boxes for cable television. The trend toward embedded systems is interesting industry suppliers such as National Semiconductor, Intel and Advanced Micro Devices, Much of the interest in PC architecture comes from the availability of low-cost hardware and software. However, observers note that the PC architecture aims at general computing, and may not be the best hardware solution for embedded systems. Further, PC architecture is not designed for industrial use and, critics point out, it is difficult to safeguard against theft of intellectual property.

Forecasts and trends, Industry trend, Processor architecture, Processor architectures, Embedded systems, Embedded system, Buses (Computers), Bus architecture

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Socket carriers stay ahead of trends

Article Abstract:

Socket suppliers have developed sockets that eliminate the traditional insulator, a capability evolved as a natural progression in the miniaturization trend. The expanding flexibility and versatility of discrete pin receptacles and their use with socket carriers has allowed engineers to remove the socket insulator. Socket carrier portions can be made of a rigid material or in a flexible, removable style. Carriers are then loaded with pin receptacles and inserted in a PC. With pins inserted into circuit boards, components are inserted into a socket that uses the board's dielectric properties for insulation. This alternative enhances the potential for shorter propagation from the IC to its traces and allows space savings in the component profile. Also, better ventilation of the IC can be had with the elimination of the insulator. Receptacles can be customized so that a high-density IC can be put into a raised bed of individual sockets for SIP, DIP, PGA or other configurations.

Integrated circuit design, Circuit design, Smart cards, Integrated circuit cards

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Memory makers grapple with embedded reality

Article Abstract:

The semiconductor memory market is facing a new challenge from embedded memory applications, in addition to its traditional challenges of steep price swings and unpredictable demand. According to Dan McCranie, vise president of sales and marketing at Cypress Semiconductor, embedded memory in products such as microsprocessors and ASICs has stunted the growth of the static RAM (SRAM) market. He says the life cycle curves of SRAMs are shortening. This trend is attributable in part to the increasing number of engineers trained in the Verilog and VHDL languages, according to McCranie. Although combining logic and memory on a single chip faces difficulties, it saves on-board space and system cost.

Semiconductor and Related Device Manufacturing, IC Memory Chips, Semiconductor memory, Computer memory, Semiconductors

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