Functional chips on 300 mm wafers
Article Abstract:
Semiconductor300 of Dresden, Germany, has started production of fully- functional chips that were fabricated using a 300-mm equipment. The 64M DRAM devices were processed through the sub-quarter technology that was part of Semiconductor300's R&D outlay of over DM1 billion. Siemens Semiconductors and Motorola, the joint venture partners involved in Semiconductor300, plan to install the technology in their respective production plants after it has been proven.
Publication Name: Semiconductor International
Subject: Electronics and electrical industries
ISSN: 0163-3767
Year: 1999
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Philips develops fastest silicon BiCMOS Process
Article Abstract:
Philips Semiconductors of Eindhoven, the Netherlands, has unveiled a silicon BiCMOS process technology that can be utilized to manufacture devices with fmax values of ~70 GHz, which is approximately double the typical values previously attained for silicon production devices. The company's estimation showed that the new QUBiC3 process can be employed to manufacture devices at around two/third the cost of GaAs and SiGe products.
Publication Name: Semiconductor International
Subject: Electronics and electrical industries
ISSN: 0163-3767
Year: 1999
User Contributions:
Comment about this article or add new information about this topic:
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