No more PFC emissions in plasma chamber cleaning?
Article Abstract:
Semiconductor manufacturers are exerting effort to support the World Semiconductor Council's promise of a 10% reduction in global-warming PFC emissions by 2010, with a 1995 baseline. The industry's collective contribution to lowering, if not eliminating, PFC emissions through plasma abatement for etching and process optimization CVD chamber cleaning is reflected on three papers presented in the 1999 American Vacuum Society fall symposium. These include the studies conducted by the University of Illinois, Air Products and Chemicals, and Applied Materials.
Publication Name: Semiconductor International
Subject: Electronics and electrical industries
ISSN: 0163-3767
Year: 2000
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Researchers examine wet clean efficiency of noble metals
Article Abstract:
Wet cleaning chemistries are effective for removing copper and silver from silicon surfaces to contamination levels below the 1.0 x 10 (super 9) atoms/square centimeter level, according to researchers at Tohoku University in Sendai, Japan, Samsung Electronics Corp in Kyunggi-Do, Korea and Kurita Water Industries Ltd in Kanagawa, Japan. Wet cleaning processes, however, were found to be less effective for removing gold contaminants.
Publication Name: Semiconductor International
Subject: Electronics and electrical industries
ISSN: 0163-3767
Year: 2000
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Post-metal-etch cleaning analyzed
Article Abstract:
A research was conducted to analyze state-of-the-art post-metal-etch cleaning with a view of gaining a greater understanding of the role of each step in removing etch residues. The study, in particular, analyzed the compositions and species of the dry-etch-related residues and their progression during the cleaning process. Results indicate the importance of wet chemistry following plasma cleans.
Publication Name: Semiconductor International
Subject: Electronics and electrical industries
ISSN: 0163-3767
Year: 1999
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