Vacuum pumps now run hotter and better

Article Abstract:

Vacuum pumps for the semiconductor industry are facing new challenges. The industry's initiatives towards 300-mm wafer processing has created a need for higher pumping speeds, while efforts towards smaller geometries have increased attention towards particle generation, which may emanate from vacuum pumps due to the backstreaming phenomenon. In addition, vacuum pumps are being configured to use several new materials, such as low dielectric constant materials and copper, amid the industry's desire to reduce interconnect capacitances and resistances, while clients are asking vacuum pump suppliers to furnish greater reliability and extended warranties.

Comment:

Vacuum pumps for semiconductor arena are facing new challenges, amid transition towards new dimensions, materials & efficiencies

Air and Gas Compressor Manufacturing, Product information, Vacuum Pumps ex Cryogenic, Vacuum pumps, Article

---

Activate and anneal ultrashallow junctions with lasers

Article Abstract:

Fremont, CA-based XMR Corp has developed excimer laser annealing (ELA) as an option to both lamp- or furnace-based ion implantation with rapid thermal processors. ELAs can heat wafers very quickly at around 10 billion centigrade per second, cover limited areas of the wafer surface in heating and also eliminate the possibility of defect-enhanced diffusion effects that include transient enhanced diffusion.

Manufacturing processes, All Other Miscellaneous Electrical Equipment and Component Manufacturing, Excimer Lasers, XMR Corp.

---

Similar abstracts:

• Abstracts: Fujitsu General Sees Growing Business in Home Theater PDPs: Flat and Thin: Trends in TV and Monitor Screens. Real-black driving method gives Panasonic PDPs contrast of 3,000:1
• Abstracts: Retailers in secondary markets strategize HDTV. Independents sell innovation not price. Office peripherals: differentiate to sell
• Abstracts: Lithography past... Near half-lambda contacts with 248 nm. Dual-damascene overcoming process issues
• Abstracts: Pursuing the perfect low-k dielectric. Striking a compromise between good and perfect silicon. Low-k dielectrics: will spin-on or CVD prevail?
• Abstracts: BST used to detect hydrogen. Atomic layer deposition targets thin films. 300 mm equipment software requirements defined

This website is not affiliated with document authors or copyright owners. This page is provided for informational purposes only. Unintentional errors are possible.