Flat solder plating boosts PCB quality
Article Abstract:
Shipley, chemical company, has developed the new 'Solderposit' process for applying normal re-flow solder onto uncovered copper in diverse electronic layouts or circuitry. The process consists of an immersion solderplating bath that plates fusible tin and lead solder via a chemical displacement reaction with the copper. This results in a uniform coating. The 'L-Ligand' complex agent makes the tin and lead suitable for plating onto copper. The process is best for using on complex, high-density surface mount device PCBs. It is also suitable for advanced fine pitch uses.
Publication Name: Eureka
Subject: Engineering and manufacturing industries
ISSN: 0261-2097
Year: 1992
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Electro fluids control pump power
Article Abstract:
Electrorheological (ER)fluids are now used to control industrial hydraulic pump power. These fluids consist of solid particle suspensions in liquids with an oily base, normally non-abrasive plastic particles in flurosilicone oil. They are safe and do not affect seals. They offer a direct interface between mecahnical devices and electronic control systems, but need to be used in systems which have been designed correctly. Their use is described in detail.
Publication Name: Eureka
Subject: Engineering and manufacturing industries
ISSN: 0261-2097
Year: 1992
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'Tailored blanks' improve pressed parts
Article Abstract:
Technology for laser butt welding metal panels with different characteristics may improve car safety. Considerations such as impact deformation and strength will determine construction. Thickness and material of patches may be different. Components are formed after welding. The innovation has application to the automotive, construction and domestic appliance industries.
Publication Name: Eureka
Subject: Engineering and manufacturing industries
ISSN: 0261-2097
Year: 1993
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