Multichip modules: next-generation packages

Article Abstract:

Multichip modules interconnect several bare dice through use of a stack of conductive and dielectric thin films; such devices have been available for some time, but recent advances have improved the performance and reduced the cost of the technology. Multichip modules are divided into three categories: MCM-L are high-density laminated printed circuit boards, MCM-C are ceramic substrates that are cofired or low-dielectric-constant (K) ceramics, and MCM-D are modules with deposited wiring on silicon substrates or ceramic and metal substrates. MCM-D devices have increasingly high wiring densities of up to 80 percent of the substrate footprint, compared to about 10 percent for conventional printed circuit boards; MCM-Ds are being used or tested by AT&T, Boeing, Rockwell International, HP and Hughes Aircraft, among others. Chip design requirements, different design approaches and connecting chips to substrates are discussed.

Circuit design, Product introduction, Increase, Packaging Density, New Technique, Enhancements, technical, Substrates, Chip Packaging

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Negotiating roadblocks

Article Abstract:

The goals of increasing density and performance in integrated circuit (IC) technology are driving developments in ever-finer feature size (scaling), multichip packaging, multiple-layer interconnection, integration of process technologies, development of neural networks, and ever-more dense cell-based ICs. Current 0.8-micron process scales will have to decrease to 0.2-micron to achieve 256M-bit memory ICs and 50-million-transistor logic chips by the year 2000. The integration of bipolar and CMOS process technologies are intended to increase the performance-to-cost ratio of IC devices. Metal interconnections now offer three-to-four layers, but the scaling of ICs to less than 1-micron increases the parasitic and cross-talk problems to be resolved. Other trends discussed include neural network, flash memory, smart power IC, and gate array developments.

Semiconductor industry, Integrated circuit fabrication, Performance improvement (Computers), Trends, Miniaturization, Performance Improvement

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