Automation needs reach new levels

Article Abstract:

The conversion to 300 mm wafers necessitates a new equipment set. IC manufacturers realize an opportunity to reduce the cost of integration by defining common requirements for automated material handling and equipment processing. Automation standards cover semiconductor fabrication aspects such as material transport and storage, material handling at the equipment, material tracking, dispatching and scheduling and equipment processing, process control and recipe management.

Market information - general

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Large-sized PolySiC wafers

Article Abstract:

Large size polycrystalline silicon carbide (PolySiC) wafers that measure as much as 150mm have been grown by employing a unique version of chemical vapor deposition designed by Indianapolis-based Sullivan and Co. The process enables silicon carbide to be quickly deposited at atomospheric pressure without 'micropipes' or porosity. Unlike other semiconductor materials, PolySiC possesses the same carrier mobility as single-crystal.

Product information

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