Front-projection HTPS panels shift to 300mm wafers
Article Abstract:
Seiko Epson Corp. is planning to manufacture 300mm quartz glass wafers for high-temperature polysilicon (HTPS) panels at its facility in Hokkaido, Japan. The company will use the wafers in panels of 3LCD projectors and televisions.
Publication Name: Journal of the Electronics Industry
Subject: Electronics and electrical industries
ISSN: 0385-4515
Year: 2005
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Intel, Dolby team up to enhance computer audio abilities
Article Abstract:
The deal between Intel Corp. and Dolby Laboratories to develop computer platforms that delivers deluxe audio by combining the latest Pentium chips and Pro Logic or Surround audio technologies is discussed.
Publication Name: Journal of the Electronics Industry
Subject: Electronics and electrical industries
ISSN: 0385-4515
Year: 2004
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Zoran chip boosts performance of Samsung digital cameras
Article Abstract:
Increase in performance of digital cameras developed by Samsung Electronics Co., Ltd. as a result of using Zoran Corp.Es Coach processor, is discussed.
Publication Name: Journal of the Electronics Industry
Subject: Electronics and electrical industries
ISSN: 0385-4515
Year: 2006
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