Makers' new chipset designed to step up adoption of 3G services
Article Abstract:
The details of the new chipsets exhibited in the 3G World Congress, which is a trade show of mobile phone industry, held in November 2004 in Hong Kong are presented. The new chipsets are developed to support the third generation mobile services.
Publication Name: Journal of the Electronics Industry
Subject: Electronics and electrical industries
ISSN: 0385-4515
Year: 2005
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3GSM show banks on HSDPA as next mobilecom wave
Article Abstract:
Synopsis on 3GSM World Congress in Cannes, France is presented. The event focused on High-Speed Downlink Packet Access telecommunication system technology.
Publication Name: Journal of the Electronics Industry
Subject: Electronics and electrical industries
ISSN: 0385-4515
Year: 2005
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Digital shift transforms CCTV to more than security tool
Article Abstract:
The increasing use of closed circuit television camera systems with digital technology i n Japan is examined.
Publication Name: Journal of the Electronics Industry
Subject: Electronics and electrical industries
ISSN: 0385-4515
Year: 2005
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