Multiple-chip module carries LSI, synchronous DRAM

Article Abstract:

Fujitsu Ltd's mutiple-chip module, which is intended for digital camcorders, combines two LSIs into a 13 x 19 x 1.7mm chip. Included in the built-in LSIs is an image-processing LSI for digital camcorders and a 64M- bit synchronous DRAM. The result is a module of around two-thirds the size of the comparable separate modules, but offers 273 pins in the full-grid version. In developing this device, the company employed a flip-chip structure for the electrical connection between the LSI chip and the substrate.

Digital ICs NEC, Digital integrated circuits, Fujitsu Ltd.

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Wireless chip from analog devices, Mitsubishi

Article Abstract:

Mitsubishi Electric Co, with the help of Analog Devices Inc, has launched a wireless chip designed for broadband CDMA mobile phones. The electronic component is equipped with a direct conversion technology that eliminates the need for an intermediate frequency circuit unit, thus reducing power consumption and production cost. In addition, the wireless chip has the capacity to directly convert RF input signals to low frequency signals.

Semiconductor Parts

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Mitsubishi's M65857FP Qsurround ICs

Article Abstract:

Mitsubishi Electric Corp's M65857FP integrated circuit generates 5.1- channel signals for multiple-speaker systems. The product is the first chip to be compatible with the Qsurround5.1 three-dimensional sound-field generation system by Q Sound Labs of Canada. In addition, it incorporates analog sound circuits with digital delay technology that prevents deterioration of the sound quality of multiple-speaker systems.

Integrated Circuits

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