Making room for more performance with chip scale packages

Article Abstract:

Chip scale packaging (CSP), a production method that began in Japan in the 1990s and was exported to the US in 1994, has emerged as a viable economical alternative to traditional multiple-chip manufacturing techniques. The process, currently limited to moderate I/O IC applications, has been successfully adapted to flash memory and is finding uses in logic and memory ICs as well. CSP offer similar material saving advantages as flip chip on board and chip on board processes.

Integrated Circuits

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White LEDs: a better light bulb?

Article Abstract:

The development of white light emitting diodes (LEDs) offers strong potential in illumination applications such as general and room lighting. White LEDs will further expand the market that already offers red LEDs used for motor vehicle rear lights. However, white LEDs require higher efficiencies prior to lighting applications. Thus, tests are being conducted to evaluate various phosphors and improve efficiency of blue and UV LEDs.

Product standards, safety, & recalls, Light Emitting Diodes, LEDs

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