Control of metal outplating from HF solutions
Article Abstract:
The Inter-University Microelectronics Centre (IMEC) of Lleuven, Belgium has conducted studies regarding the use of hydrofluoric acid (HF) in the final stages of the semiconductor manufacturing processes. HF typically leave extremely low levels of metallic contamination on the silicon surface. Results of the IMEC studies could provide a cheap and controllable way to prevent contamination by copper in cleaning technology. A technique to control the amount of the deposition of layers of copper on the silicon surface could likewise be developed.
Comment:
Belgium: A study has been conducted on how to prevent metallic contamination on silicon surfaces when using hydrofluoric acid
Publication Name: Semiconductor International
Subject: Electronics and electrical industries
ISSN: 0163-3767
Year: 1998
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Motorola to open Polish fab
Article Abstract:
Motorola of Mesa, AZ, will start the operation of its $108 million semiconductor manufacturing plant near Cracow, Poland in 1999. The facility will also include a research and development center. As many as 500 people are expected to be employed in the facility when the plant is operated at its full production capacity, which is expected in two years time. Motorola, which also operates another semiconductor manufacturing facility in the Czech Republic, is expanding its operations in that region of Europe.
Comment:
Will start the operation of its $108 million semiconductor manufacturing plant near Cracow, Poland in 1999
Publication Name: Semiconductor International
Subject: Electronics and electrical industries
ISSN: 0163-3767
Year: 1998
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Comment about this article or add new information about this topic:
Trends in wafer cleaning
Article Abstract:
Wafer cleaning technology is expected to evolve into a number of differing solutions that are specifically designed to a particular product type. The creation of new wafer designs in the range of 0.25 micrometer to 0.13 micrometer has greatly increased the amount of back end of the line cleaning processes as opposed to front end of the line processes. Research tends to favor the development of all dry cleaning processes that includes the use of UV and IR in tandem with a number of gases.
Publication Name: Semiconductor International
Subject: Electronics and electrical industries
ISSN: 0163-3767
Year: 1999
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