Single-wafer processing: soon to be reality?

Article Abstract:

Progress is being achieved in the development of single-wafer processing under a joint development project between Applied Materials Inc and Lucent Technologies. The process was initially promoted a method to address cost and cycle time issues. It became a reality when Texas Instruments successfully concluded its Microelectronics Manufacturing Science and Technology contract in 1993. Lucent intends to use Applied's single-wafer front-end process technology to possible uses in its next-generation process flow.

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IBM advance spurs "system-on-a-chip"

Article Abstract:

International Business Machines Corp has formulated a production method that will allow the placement of logic and memory circuits onto a single chip. With the use of copper technology, the approach provides a better alternative to the usual methods that typically compromise logic and memory functions. The method combines copper writing with circuitry of a minimum size of 0.15 micrometer.

Semiconductor Devices, International Business Machines Corp.

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Empty spaces in silicon (ESS): an alternative to SOI

Article Abstract:

Researchers at Toshiba Corp in Yokohama, Japan, have developed an innovative process for forming empty spaces in silicon (ESS). The new technique makes use of the self-organizing migration properties on the silicon surface. The process involves annealing deeply etched silicon substrates in a deoxidizing ambient that results in the migration of silicon atoms on the surface.

Japan

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